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Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2 Series
Soldering Process
Peak Temperature (T P )
20 seconds maximum
30 seconds maximum
6 minutes maximum
8 minutes maximum
T P
T L
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
profile conditions for convection and IR reflow reflect the profile
conditions of the IPC/J–STD–020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions.
Note that although the X/7343–43 case size can withstand wave
soldering, the tall profile (4.3 mm maximum) dictates care in wave
process development.
Hand soldering should be performed with care due to the difficulty
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
and the termination, until reflow occurs. Once reflow occurs, the
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
During typical reflow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T Smin ) 100°C 150°C
Temperature Maximum (T Smax ) 150°C 200°C
Time (t s ) from T smin to T smax ) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T L to T P ) 3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T L ) 183°C 217°C
Time Above Liquidous (t L ) 60 – 150 seconds 60 – 150 seconds
220°C* 250°C*
235°C** 260°C**
Time within 5°C of Maximum
Peak Temperature (t P )
Ramp-down Rate (T P to T L ) 6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Maximum Ramp Up Rate = 3oC/seconds t P
Maximum Ramp Down Rate = 6oC/seconds
t L
T smax
T smin
t S
25
25oC to Peak
Time
Construction
Silver Paint
MnO 2 /Ta 2 O 5 /Ta
Silver Adhesive
Washer
Leadframe
(-Cathode)
Carbon
Tantalum Wire
Weld
Leadframe
(+Anode)
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2005_T491 ? 10/8/2013
15
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